Model Number: ODM-1-1-1-1-1
Brand Name: BAM
Key Specifications/Special Features:
Material: rigid and flexible PCBBoard thicknesses: 0.6 to 3mmSurface: gold plating and immersion goldLayer: 2 to 1Blind and buried
High TG and frequency
Lead-free
Twist and warp: less than 1%
Placement precision:- 0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
Dip pitches through hole down to 0.60mm
Solder components to underside of board without disrupting the topside Inspection in line for QOI and ICT testing in line
X-ray inspection for BGA
Maximum panel size: 550 x 660mm
Minimum hole diameter: 0.35mm
Minimum line width and space: 0.1mm
Compliant with the RoHS directive